DocumentCode
1296591
Title
Laser ablation and micromachining with ultrashort laser pulses
Author
Liu, X. ; Du, D. ; Mourou, G.
Author_Institution
Center for Ultrafast Optical Sci., Michigan Univ., Ann Arbor, MI, USA
Volume
33
Issue
10
fYear
1997
fDate
10/1/1997 12:00:00 AM
Firstpage
1706
Lastpage
1716
Abstract
The mechanisms of ultrashort-pulse laser ablation of materials are discussed, and the differences to that of long laser pulses are emphasized. Ultrashort laser pulses offer both high laser intensity and precise laser-induced breakdown threshold with reduced laser fluence. The ablation of materials with ultrashort pulses has a very limited heat-affected volume. The advantages of ultrashort laser pulses are applied in precision micromachining of various materials. Some femtosecond laser pulse micromachining results, including comparison with long pulses, are presented. Ultrashort-pulse laser micromachining may have a wide range of applications where micrometer and submicrometer feature sizes are required
Keywords
avalanche breakdown; electric breakdown; high-speed optical techniques; impact ionisation; laser ablation; laser beam machining; micromachining; femtosecond laser pulse; heat-affected volume; high laser intensity; micromachining; micrometer feature sizes; precise laser-induced breakdown threshold; reduced laser fluence; submicrometer feature sizes; ultrashort laser pulses; ultrashort-pulse laser ablation; Gas lasers; Laser ablation; Laser applications; Laser beam cutting; Machining; Micromachining; Optical materials; Optical pulses; Pulse amplifiers; Ultrafast optics;
fLanguage
English
Journal_Title
Quantum Electronics, IEEE Journal of
Publisher
ieee
ISSN
0018-9197
Type
jour
DOI
10.1109/3.631270
Filename
631270
Link To Document