DocumentCode :
1296655
Title :
Issues in the Use of Thermal Transients to Achieve Accurate Time-Constant Spectrums and Differential Structure Functions
Author :
Salleras, Marc ; Carmona, Manuel ; Marco, Santiago
Author_Institution :
Mech. & Aerosp. Eng. Dept., Univ. of California Irvine, Irvine, CA, USA
Volume :
33
Issue :
4
fYear :
2010
Firstpage :
918
Lastpage :
923
Abstract :
An analysis of accuracy of time-constant spectrum extraction from thermal transients has been performed. Numerical calculations based on analytical models and finite element method simulations have been used in order to obtain the thermal transients. Simple geometries have been used such that analytical expressions for their time-constant spectrums are known. Results show that a large error in the time-constant spectrum is obtained for very small rms error (<;1 mK) in the thermal transient. The estimation problem is ill-conditioned. Moreover, the differential structure function shows a low accuracy identifying stacked structures. The initial part of the differential structure function shows numerical oscillations and the final part has an asymptotic behavior to infinity that has been identified as an artifact related to errors in the time-constant spectrum estimation. Peak identification from the differential structure function heavily depends on an accurate determination of the time-constant spectrum. The limited spectral resolution and dynamic range of the differential structure function are a direct consequence of the time-constant spectrum imprecision.
Keywords :
finite element analysis; spectral analysis; accurate time-constant spectrums; asymptotic behavior; differential structure functions; estimation problem; finite element method; peak identification; spectral resolution; thermal transients; time-constant spectrum estimation; time-constant spectrum extraction; time-constant spectrum imprecision; Analytical models; Electronic packaging thermal management; Finite element methods; Impedance; Integrated circuit modeling; Integrated circuit packaging; Material properties; Noise level; Silicon; Slabs; Thermal analysis; Transient analysis; Differential structure function; packaging; thermal transient; time-constant spectrum;
fLanguage :
English
Journal_Title :
Advanced Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3323
Type :
jour
DOI :
10.1109/TADVP.2010.2049572
Filename :
5549952
Link To Document :
بازگشت