• DocumentCode
    129757
  • Title

    Visualization of time evolving wavefront advance in polycrystalline materials

  • Author

    Blackshire, James L.

  • Author_Institution
    RXCA, Air Force Res. Lab., Wright-Patterson AFB, OH, USA
  • fYear
    2014
  • fDate
    3-6 Sept. 2014
  • Firstpage
    757
  • Lastpage
    760
  • Abstract
    The nondestructive quantification of polycrystalline grain feature information in aerospace materials is an important area of recent research, where spatially-resolved measurements related to mean grain size, grain size distribution, and crystallographic orientation are needed for engineering analysis and material state awareness evaluations. In the present effort, the interaction of ultrasonic surface acoustic waves (SAW) with a dual-microstructure nickel polycrystalline material is studied, where an innovative wavefront imaging method is utilized to visualize and study the time-evolving advance of the primary, forward propagating wavefront through microstructure grain features on the material surface. The method involves a first-arrival, time-gated analysis of scanning laser vibrometry signal content, where the apparent motion of the wavefront through individual and clustered grains is observed and attributed to local changes in the orientation-dependent crystallographic slowness.
  • Keywords
    grain size; surface acoustic wave devices; ultrasonic materials testing; vibration measurement; aerospace materials; crystallographic orientation; engineering analysis; grain size distribution; material state awareness evaluation; nondestructive quantification; polycrystalline materials; scanning laser vibrometry; spatially resolved measurements; time evolving wavefront advance visualization; ultrasonic surface acoustic waves; wavefront imaging; Acoustic measurements; Materials; Measurement by laser beam; Scattering; Surface acoustic waves; Ultrasonic variables measurement; Polycrystalline Materials; Scanning Laser Vibrometry; Slowness;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium (IUS), 2014 IEEE International
  • Conference_Location
    Chicago, IL
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2014.0187
  • Filename
    6932215