Title :
A fully matched LTE-A carrier aggregation quadplexer based on BAW and SAW technologies
Author :
Mingdong Li ; El-Hakiki, Mohamed ; Kalim, Danish ; Tae-Young Kim ; Link, A. ; Schumann, Bert ; Aigner, Robert
Author_Institution :
Munich Design Center, TriQuint Semicond., Munich, Germany
Abstract :
An inter-band carrier aggregation (CA) quadplexer allows doubling the download rates and is therefore an important element in upcoming mobile phone systems. In a duplexer design, both Tx and Rx filters should behave like an open-circuit for respective counter-bands at the antenna port. Additionally, they have to attain high suppression in their counter-band to get good in-band isolation. The situation gets more difficult and challenging for a CA quadplexer. Besides an open-circuit requirement for now 3 bands simultaneously, each Tx filter should achieve high suppression in the frequency range of both Rx filters in order to get high in-band and cross-isolation. The same applies for each Rx filter. Generally, it is not sufficient to simply expand the well-known topology concepts of duplexers rather a different design methodology is required. In this paper we will discuss several approaches to realize a CA quadplexer and present an implementation of a B25-B4 CA quadplexer sized 3.6×2.0×0.8mm3 utilizing the company´s advanced acoustic wave filtering technologies: bulk acoustic wave (BAW) and surface acoustic wave (SAW).
Keywords :
Long Term Evolution; acoustic filters; antennas; bulk acoustic wave devices; mobile handsets; multiplexing equipment; surface acoustic wave filters; BAW; Rx filters; SAW; Tx filters; acoustic wave filtering; antenna port; bulk acoustic wave; cross-isolation; download rate doubling; duplexer design; fully matched LTE-A carrier aggregation quadplexer; in-band isolation; interband carrier aggregation important; mobile phone systems; surface acoustic wave; Antennas; Coils; Floors; Phase shifters; Resonator filters; Surface acoustic waves; BAW; Carrier Aggregation; Duplexer; LTE; Quadplexer; SAW;
Conference_Titel :
Ultrasonics Symposium (IUS), 2014 IEEE International
Conference_Location :
Chicago, IL
DOI :
10.1109/ULTSYM.2014.0020