Title : 
High throughput production of uniformly-sized fluorocarbon emulsions for ultrasonic therapy using a silicon-based microfluidic system
         
        
            Author : 
Fabiilli, Mario L. ; Silpe, Justin ; Rush, Collin ; Lemmerhirt, David ; Tang, Edward ; Vasey, Gina ; Kripfgans, Oliver D.
         
        
            Author_Institution : 
Dept. of Radiol., Univ. of Michigan Health Syst., Ann Arbor, MI, USA
         
        
        
        
        
        
            Abstract : 
Sonosensitive particles such as microbubbles and emulsions are typically produced using methods that generate a wide range of particle sizes. These polydisperse distributions are not ideal and thus research efforts have focused on developing techniques to generate more uniformly-sized particles. This works demonstrates the fabrication of a massively parallel microfluidic device consisting of 2,500 channels, which enables fast production rates compared to single channel microfluidic devices. Fluorocarbon emulsions were generated using this device and sized with a Coulter counter. The mean droplet diameters ranged from 5 to 8 μm with coefficients of variance in the range of 14-40%. Production rates as high as 6.5 MHz were observed. Overall, these results indicate that uniformly-sized emulsions can be generated at rates feasible for scale-up.
         
        
            Keywords : 
aeroacoustics; bubbles; drops; elemental semiconductors; emulsions; microfluidics; particle size; silicon; ultrasonics; Coulter counter; Si; droplets; massively parallel microfluidic device; microbubbles; particle sizes; polydisperse distributions; production rates; silicon-based microfluidic system; single channel microfluidic devices; sonosensitive particles; ultrasonic therapy; uniformly-sized fluorocarbon emulsions; variance coefficients; Acoustics; Junctions; Microfluidics; Microscopy; Production; Radiation detectors; Silicon; contrast agents; emulsions; microfluidic; perfluorocarbon; ultrasound; uniform-sized;
         
        
        
        
            Conference_Titel : 
Ultrasonics Symposium (IUS), 2014 IEEE International
         
        
            Conference_Location : 
Chicago, IL
         
        
        
            DOI : 
10.1109/ULTSYM.2014.0439