Title :
Novel Nonconductive Adhesives/Films With Carbon Nanotubes for High-Performance Interconnects
Author :
Jiang, Hongjin ; Yim, Myung Jin ; Lin, Wei ; Wong, C.P.
Author_Institution :
Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
Novel nonconductive adhesives/films (NCAs/NCFs) with carbon nanotubes (CNTs) for high-performance interconnects were developed. A small amount of CNTs inside NCAs/NCFs could increase the thermal conductivities and at the same time decrease the coefficient of thermal expansion (CTE) for high thermomechanical reliability of the NCAs/NCFs´ interconnect joints. Thermal mechanical analyzer measurements showed that the CTE value of the 0.03 wt% CNT filled NCAs/NCFs was significantly decreased. Current-voltage characterizations showed that the current carrying capabilities of the CNT (0.03 wt%) filled NCAs/NCFs were increased by 14% compared to the unfilled NCAs/NCFs due to the more efficient thermal dissipation and higher electrical conductivity by CNTs.
Keywords :
adhesives; carbon nanotubes; electrical conductivity; integrated circuit interconnections; nanotube devices; reliability; thermal conductivity; C; carbon nanotubes; current-voltage characterization; electrical conductivity; high-performance interconnects; mechanical analyzer measurements; nonconductive adhesives; nonconductive films; thermal conductivities; thermal dissipation; thermal expansion coefficient; thermomechanical reliability; Carbon nanotubes; conductive adhesives; interconnections; lead-free; materials science and technology;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/TCAPT.2009.2014742
