Title :
Model-driven engineering applied to the development of embedded software for B-mode ultrasound imaging systems - A case study
Author :
Onisto, Haroldo Jose ; de Moraes Machado, Tiago ; Cravo Fernandes, Ramon ; Dantas de Medeiros Junior, Johannes ; Tamagno, Iliezer ; Dezotti, Tiago Cesar ; Bertuzzo, Jose Eduardo
Author_Institution :
Dept. of Services & Hardware Eng., Eldorado Res. Inst., Campinas, Brazil
Abstract :
Our society has been experiencing an increasing dependence on medical devices. Errors in design and implementation of these systems can bring serious consequences. Technical and commercial demands are pushing the need for producing embedded devices in less time and with more features added to the final product. To deal with the difficulties of this scenario, it is presented a case study on how ELDORADO has deployed Model-driven Engineering (MDE) to develop a Real-time Ultrasound Modular Platform, which aims to be used for medical research purpose. Over 80% of the algorithms for the formation of B-mode images were developed based on this paradigm. Qualitative results demonstrate the potential of MDE application along with a consistent heterogeneous architecture and hardware/software codesign to achieve modularity, flexibility and loose coupling among signal processing, firmware/hardware.
Keywords :
biomedical ultrasonics; medical computing; medical image processing; software engineering; B-mode image formation; B-mode ultrasound imaging systems; ELDORADO; embedded devices; embedded software; firmware; flexibility; hardware-software codesign; medical devices; model driven engineering; modularity; real time ultrasound modular platform; signal processing; Digital signal processing; Field programmable gate arrays; Hardware; Medical diagnostic imaging; Real-time systems; Ultrasonic imaging; automatic code generation; digital beamforming; embedded software development; model-driven engineering; real-time ultrasound images; ultrasound signal processing;
Conference_Titel :
Ultrasonics Symposium (IUS), 2014 IEEE International
Conference_Location :
Chicago, IL
DOI :
10.1109/ULTSYM.2014.0311