• DocumentCode
    1298283
  • Title

    The dependence of channel length on channel width in narrow-channel CMOS devices for 0.35-0.13 μm technologies

  • Author

    Hook, T.B. ; Biesemans, S. ; Slinkman, J.

  • Author_Institution
    IBM Microelectron. Div., Essex Junction, VT, USA
  • Volume
    21
  • Issue
    2
  • fYear
    2000
  • Firstpage
    85
  • Lastpage
    87
  • Abstract
    We have found that narrow-channel PFET´s do not have the same effective channel length as wide PFET´s with the same polysilicon length. Narrow PFET devices are longer than their wide counterparts by 20-40 nm while narrow NFET devices are negligibly different from wide NFET´s. This phenomenon occurs in a wide variety of technologies, from 0.13 and 0.18 μm technologies with extension/halo devices to a 0.35-μm technology with simple abrupt-junction devices. Depending on the details of the short-channel rolloff behavior, this phenomenon may result in apparent anomalous narrow-channel threshold voltage behavior. We suggest that the modification of the boron redistribution by the mechanical stress imposed by the bounding isolation SiO2 may explain the effect.
  • Keywords
    CMOS integrated circuits; MOSFET; boron; doping profiles; integrated circuit technology; stress effects; 0.13 to 0.35 micron; B redistribution modification; CMOSFETs; Si:B; SiO/sub 2/; SiO/sub 2/ bounding isolation; abrupt-junction devices; anomalous narrow-channel threshold voltage behavior; channel length dependence; channel width; halo devices; mechanical stress; narrow-channel CMOS devices; narrow-channel PFETs; narrow-channnel NFETs; short-channel rolloff behavior; Boron; CMOS technology; Current measurement; Isolation technology; Mechanical factors; Microelectronics; Random access memory; Semiconductor devices; Stress; Threshold voltage;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/55.821680
  • Filename
    821680