DocumentCode
1298283
Title
The dependence of channel length on channel width in narrow-channel CMOS devices for 0.35-0.13 μm technologies
Author
Hook, T.B. ; Biesemans, S. ; Slinkman, J.
Author_Institution
IBM Microelectron. Div., Essex Junction, VT, USA
Volume
21
Issue
2
fYear
2000
Firstpage
85
Lastpage
87
Abstract
We have found that narrow-channel PFET´s do not have the same effective channel length as wide PFET´s with the same polysilicon length. Narrow PFET devices are longer than their wide counterparts by 20-40 nm while narrow NFET devices are negligibly different from wide NFET´s. This phenomenon occurs in a wide variety of technologies, from 0.13 and 0.18 μm technologies with extension/halo devices to a 0.35-μm technology with simple abrupt-junction devices. Depending on the details of the short-channel rolloff behavior, this phenomenon may result in apparent anomalous narrow-channel threshold voltage behavior. We suggest that the modification of the boron redistribution by the mechanical stress imposed by the bounding isolation SiO2 may explain the effect.
Keywords
CMOS integrated circuits; MOSFET; boron; doping profiles; integrated circuit technology; stress effects; 0.13 to 0.35 micron; B redistribution modification; CMOSFETs; Si:B; SiO/sub 2/; SiO/sub 2/ bounding isolation; abrupt-junction devices; anomalous narrow-channel threshold voltage behavior; channel length dependence; channel width; halo devices; mechanical stress; narrow-channel CMOS devices; narrow-channel PFETs; narrow-channnel NFETs; short-channel rolloff behavior; Boron; CMOS technology; Current measurement; Isolation technology; Mechanical factors; Microelectronics; Random access memory; Semiconductor devices; Stress; Threshold voltage;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/55.821680
Filename
821680
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