DocumentCode
1298340
Title
Increased Deep-Level Hole Trapping by Combined Negative-Bias Temperature and Channel Hot-Hole Stress
Author
Ho, T.J.J. ; Ang, D.S. ; Leong, K.C.
Author_Institution
Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore, Singapore
Volume
32
Issue
10
fYear
2011
Firstpage
1337
Lastpage
1339
Abstract
Trapping of holes at deep energy states under negative-bias-temperature instability (NBTI) is examined in the presence of a nonzero drain bias [i.e., channel hot-hole (CHH) effect]. While the total density of switching hole traps is unchanged after the combined NBTI and CHH stress (implying no additional creation of such traps for the conditions studied), evidence shows that the density of deep-level switching hole traps is increased. Enhanced carrier-lattice interaction under hot-hole injection is believed to induce the greater structural relaxation inherent to specific precursor sites for these deep-level hole traps. Implications of this observation are briefly discussed.
Keywords
MOSFET; hot carriers; carrier-lattice interaction; channel hot-hole stress; combined negative-bias temperature; deep-level hole trapping; negative-bias-temperature instability; nonzero drain bias; Charge carrier processes; Degradation; Hot carriers; Interface states; Logic gates; Stress; Switches; Bias-temperature instability; MOSFET; hot-carrier effect; oxynitride gate dielectric;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/LED.2011.2162482
Filename
5985467
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