• DocumentCode
    1298340
  • Title

    Increased Deep-Level Hole Trapping by Combined Negative-Bias Temperature and Channel Hot-Hole Stress

  • Author

    Ho, T.J.J. ; Ang, D.S. ; Leong, K.C.

  • Author_Institution
    Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore, Singapore
  • Volume
    32
  • Issue
    10
  • fYear
    2011
  • Firstpage
    1337
  • Lastpage
    1339
  • Abstract
    Trapping of holes at deep energy states under negative-bias-temperature instability (NBTI) is examined in the presence of a nonzero drain bias [i.e., channel hot-hole (CHH) effect]. While the total density of switching hole traps is unchanged after the combined NBTI and CHH stress (implying no additional creation of such traps for the conditions studied), evidence shows that the density of deep-level switching hole traps is increased. Enhanced carrier-lattice interaction under hot-hole injection is believed to induce the greater structural relaxation inherent to specific precursor sites for these deep-level hole traps. Implications of this observation are briefly discussed.
  • Keywords
    MOSFET; hot carriers; carrier-lattice interaction; channel hot-hole stress; combined negative-bias temperature; deep-level hole trapping; negative-bias-temperature instability; nonzero drain bias; Charge carrier processes; Degradation; Hot carriers; Interface states; Logic gates; Stress; Switches; Bias-temperature instability; MOSFET; hot-carrier effect; oxynitride gate dielectric;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2011.2162482
  • Filename
    5985467