DocumentCode :
1298389
Title :
A Novel Three-Dimensional Microheater
Author :
Xu, Lei ; Li, Tie ; Wang, Yuelin
Author_Institution :
State Key Lab. of Transducer Technol., Chinese Acad. of Sci., Shanghai, China
Volume :
32
Issue :
9
fYear :
2011
Firstpage :
1284
Lastpage :
1286
Abstract :
This letter, for the first time, reports a novel 3-D microheater. A platinum (Pt) heating resistor fabricated by a photoresist-spray-coating-based lift-off process is embedded in a concave dielectric membrane. For thermal isolation, this concave membrane is connected to a bulk silicon chip via two slender beams with a silicon pit formed by anisotropic etching under it. A large active area of 46 960 μm2 can be heated to 400°C at a power of 30 mW. A low power per active area of 6.39 × 10-4 has been achieved, which is only half of or less than that in current 2-D microheaters.
Keywords :
beams (structures); etching; heat systems; isolation technology; microfabrication; micromechanical devices; photoresists; resistance heating; resistors; spray coatings; Si-Pt; anisotropic etching; bulk silicon chip; concave dielectric membrane; concave membrane; photoresist-spray-coating-based lift-off process; platinum heating resistor fabrication; silicon pit; slender beam; thermal isolation; three-dimensional microheater; Gas detectors; Heating; Power demand; Resistors; Silicon; Temperature measurement; 3-D; Microheater; photoresist spray coating; power per active area (PPAA);
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2011.2160145
Filename :
5985474
Link To Document :
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