• DocumentCode
    1298389
  • Title

    A Novel Three-Dimensional Microheater

  • Author

    Xu, Lei ; Li, Tie ; Wang, Yuelin

  • Author_Institution
    State Key Lab. of Transducer Technol., Chinese Acad. of Sci., Shanghai, China
  • Volume
    32
  • Issue
    9
  • fYear
    2011
  • Firstpage
    1284
  • Lastpage
    1286
  • Abstract
    This letter, for the first time, reports a novel 3-D microheater. A platinum (Pt) heating resistor fabricated by a photoresist-spray-coating-based lift-off process is embedded in a concave dielectric membrane. For thermal isolation, this concave membrane is connected to a bulk silicon chip via two slender beams with a silicon pit formed by anisotropic etching under it. A large active area of 46 960 μm2 can be heated to 400°C at a power of 30 mW. A low power per active area of 6.39 × 10-4 has been achieved, which is only half of or less than that in current 2-D microheaters.
  • Keywords
    beams (structures); etching; heat systems; isolation technology; microfabrication; micromechanical devices; photoresists; resistance heating; resistors; spray coatings; Si-Pt; anisotropic etching; bulk silicon chip; concave dielectric membrane; concave membrane; photoresist-spray-coating-based lift-off process; platinum heating resistor fabrication; silicon pit; slender beam; thermal isolation; three-dimensional microheater; Gas detectors; Heating; Power demand; Resistors; Silicon; Temperature measurement; 3-D; Microheater; photoresist spray coating; power per active area (PPAA);
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2011.2160145
  • Filename
    5985474