• DocumentCode
    129872
  • Title

    Remote excitation of a bulk acoustic wave sensing platform

  • Author

    Curtis-Bray, Nicole ; Stennett, Rahim ; Wallace, Sean ; Emanetoglu, Nuri ; Vetelino, John

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Maine, Orono, ME, USA
  • fYear
    2014
  • fDate
    3-6 Sept. 2014
  • Firstpage
    2462
  • Lastpage
    2465
  • Abstract
    The remote excitation of the transverse shear mode (TSM) in bare AT-cut quartz crystals used in sensor applications would eliminate the deleterious effects introduced by the electrodes deposited on the quartz crystal. Antenna structures ranging from spiral coil antennas to simple line antennas have been examined for remote TSM excitation. However, factors such as the antenna type and orientation, the orientation of the crystals relative to the electric field emanating from the antenna and the geometry of the quartz sample, all of which are critical to efficient TSM excitation were often not addressed. In the present work, a study of the remote excitation of the TSM in AT-cut quartz as a function of the afore mentioned factors is performed. All of these factors were found to be critical to efficient TSM excitation. Finally, it is demonstrated that an electrode-less sensor array can be realized to detect multiple target analytes.
  • Keywords
    antennas; bulk acoustic wave devices; crystal resonators; elastic waves; piezoelectric materials; quartz; TSM excitation efficiency; antenna orientation; antenna structures; antenna type; bare AT-cut quartz crystals; bulk acoustic wave sensing platform; crystal orientation; electric field; electrodeless sensor array; multiple target analytes; quartz geometry; remote TSM excitation; sensor applications; simple line antennas; spiral coil antennas; transverse shear mode; Antenna feeds; Crystals; Electromagnetic scattering; Lead; Resonant frequency; Bulk acoustic waves; antenna; remote excitation; remote sensing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium (IUS), 2014 IEEE International
  • Conference_Location
    Chicago, IL
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2014.0614
  • Filename
    6932331