Title : 
A CMUT-based finger-mounted 3D ultrasound probe
         
        
            Author : 
Chen, Albert I. H. ; Wong, Lawrence L. P. ; Yeow, John T. W.
         
        
            Author_Institution : 
Dept. of Syst. Design Eng., Univ. of Waterloo, Waterloo, ON, Canada
         
        
        
        
        
        
            Abstract : 
Developing 2D array-based systems for 3D imaging is overall more challenging due to the complexity in addressing the transducer elements. The Row-Column (RC) scheme results in a significant reduction in electrical leads at a reasonable cost in imaging quality. This paper presents imaging analysis on RC beamforming and provides evidence on why an RC-based Capacitive Micromachined Ultrasonic Transducer (RC CMUT) array is suitable for mounting on the finger-tip for close-up imaging. The prototype can be fitted over a finger and be used for scanning a small targeted volume. The front-end electronics are also designed so that the device can be hands-free and be attached to the back of the hand. The simulation and experiment shows that the calculated scanning volume is highly limited by natural focusing. For a 4.8mm by 4.8mm, 5.9MHz, 32×32 elements RC CMUT array, the calculated -6dB lateral resolution ranges from 0.3mm to 1mm within a 10mm depth. The effective scanning volume, given a 1mm resolution threshold, is approximately 4.5mm by 4.5mm by 10mm.
         
        
            Keywords : 
acoustic imaging; array signal processing; ultrasonic transducer arrays; 2D array-based systems; 3D imaging; CMUT-based finger-mounted 3D ultrasound probe; RC CMUT array; RC beamforming; RC-based capacitive micromachined ultrasonic transducer array; close-up imaging; finger-tip; frequency 5.9 MHz; front-end electronics; natural focusing; row-column scheme; scanning volume; transducer elements; Apertures; Arrays; Focusing; Probes; Three-dimensional displays; Ultrasonic imaging; CMUT; row-column addressing; volumetric imaging;
         
        
        
        
            Conference_Titel : 
Ultrasonics Symposium (IUS), 2014 IEEE International
         
        
            Conference_Location : 
Chicago, IL
         
        
        
            DOI : 
10.1109/ULTSYM.2014.0397