DocumentCode
1299082
Title
Application of polyimide resin to semiconductor devices in Japan
Author
Makino, D.
Author_Institution
Hitachi Chem. Co. Ltd., Yamazaki, Japan
Volume
4
Issue
2
fYear
1988
Firstpage
15
Lastpage
23
Abstract
Polyimide resins that have been developed and marketed for semiconductor applications by Japanese companies are reviewed. Test results for devices in which polyimide resins are used as the interlayer insulator, alpha-ray shielding, or buffer coating film are presented. The status of the development of new polyimides for semiconductors is discussed.<>
Keywords
insulation testing; organic insulating materials; semiconductor devices; Japanese companies; alpha-ray shielding; buffer coating film; interlayer insulator; polyimide resin; semiconductor devices; Chemical industry; Insulation; Large scale integration; Planarization; Polyimides; Polymer films; Production; Resins; Semiconductor devices; Semiconductor films; Adult; Allergens; Dermatitis, Allergic Contact; False Positive Reactions; Female; Humans; Male; Patch Tests;
fLanguage
English
Journal_Title
Electrical Insulation Magazine, IEEE
Publisher
ieee
ISSN
0883-7554
Type
jour
DOI
10.1109/57.822
Filename
822
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