DocumentCode :
1299082
Title :
Application of polyimide resin to semiconductor devices in Japan
Author :
Makino, D.
Author_Institution :
Hitachi Chem. Co. Ltd., Yamazaki, Japan
Volume :
4
Issue :
2
fYear :
1988
Firstpage :
15
Lastpage :
23
Abstract :
Polyimide resins that have been developed and marketed for semiconductor applications by Japanese companies are reviewed. Test results for devices in which polyimide resins are used as the interlayer insulator, alpha-ray shielding, or buffer coating film are presented. The status of the development of new polyimides for semiconductors is discussed.<>
Keywords :
insulation testing; organic insulating materials; semiconductor devices; Japanese companies; alpha-ray shielding; buffer coating film; interlayer insulator; polyimide resin; semiconductor devices; Chemical industry; Insulation; Large scale integration; Planarization; Polyimides; Polymer films; Production; Resins; Semiconductor devices; Semiconductor films; Adult; Allergens; Dermatitis, Allergic Contact; False Positive Reactions; Female; Humans; Male; Patch Tests;
fLanguage :
English
Journal_Title :
Electrical Insulation Magazine, IEEE
Publisher :
ieee
ISSN :
0883-7554
Type :
jour
DOI :
10.1109/57.822
Filename :
822
Link To Document :
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