Title :
Describing Reflectances for Color Segmentation Robust to Shadows, Highlights, and Textures
Author :
Vazquez, Eduard ; Baldrich, Ramon ; van de Weijer, Joost ; Vanrell, Maria
Author_Institution :
Comput. Vision Center, Edifici O, Univ. Autonoma de Barcelona, Barcelona, Spain
fDate :
5/1/2011 12:00:00 AM
Abstract :
The segmentation of a single material reflectance is a challenging problem due to the considerable variation in image measurements caused by the geometry of the object, shadows, and specularities. The combination of these effects has been modeled by the dichromatic reflection model. However, the application of the model to real-world images is limited due to unknown acquisition parameters and compression artifacts. In this paper, we present a robust model for the shape of a single material reflectance in histogram space. The method is based on a multilocal creaseness analysis of the histogram which results in a set of ridges representing the material reflectances. The segmentation method derived from these ridges is robust to both shadow, shading and specularities, and texture in real-world images. We further complete the method by incorporating prior knowledge from image statistics, and incorporate spatial coherence by using multiscale color contrast information. Results obtained show that our method clearly outperforms state-of-the-art segmentation methods on a widely used segmentation benchmark, having as a main characteristic its excellent performance in the presence of shadows and highlights at low computational cost.
Keywords :
image colour analysis; image segmentation; image texture; statistical analysis; color segmentation robust; compression artifacts; dichromatic reflection model; histogram space; image measurements; image statistics; material reflectances; multilocal creaseness analysis; real-world images; single material reflectance; Histograms; Image color analysis; Image segmentation; Materials; Robustness; Shape; Spatial coherence; Segmentation; color.;
Journal_Title :
Pattern Analysis and Machine Intelligence, IEEE Transactions on
DOI :
10.1109/TPAMI.2010.146