• DocumentCode
    130020
  • Title

    Automated assembly of biological cells in a 3D scaffold via dielectrophoresis manipulation

  • Author

    Zhijie Huan ; Chu, Henry K. ; Jie Yang ; Dong Sun

  • Author_Institution
    Dept. of Precision Machinery & Instrum., Univ. of Sci. & Technol. of China, Hefei, China
  • fYear
    2014
  • fDate
    28-30 July 2014
  • Firstpage
    345
  • Lastpage
    349
  • Abstract
    Patterning and assembly of biological cells in a 3D structure represents an important process in artificial tissue engineering. This paper presents the design of a multi-layer electrode scaffold used to assemble biological cells into a 3D pattern. Through suppling voltage to the multi-layer scaffold, three-dimensional electric fields can be established to manipulate cells towards the scaffold via dielectrophoresis (DEP). To fabricate such a 3D scaffold, we utilized the laser cutting technology to cut stainless steel into a precision structure with integrated micro-tips. Layers of the structure were then stacked together forming the 3D scaffold. Experiments were conducted and the scaffold was able to generate the DEP force and assemble biological cells at the desired positions with required patterning.
  • Keywords
    bioMEMS; bioelectric potentials; biomedical electrodes; biomedical materials; cellular biophysics; electrophoresis; laser beam cutting; microelectrodes; microfabrication; multilayers; stainless steel; tissue engineering; 3D scaffold; 3D structure; DEP force; artificial tissue engineering; automated assembly; biological cell assembly; biological cell patterning; dielectrophoresis manipulation; integrated microtips; laser cutting technology; multilayer electrode scaffold; precision structure; stainless steel; three-dimensional electric fields; Biological cells; Dielectrophoresis; Electric fields; Electrodes; Force; Three-dimensional displays; Tissue engineering;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Information and Automation (ICIA), 2014 IEEE International Conference on
  • Conference_Location
    Hailar
  • Type

    conf

  • DOI
    10.1109/ICInfA.2014.6932679
  • Filename
    6932679