Evaluating Carbon Nanotube Global Interconnects for Chip Multiprocessor Applications

Author

Pasricha, Sudeep ; Kurdahi, Fadi J. ; Dutt, Nikil

Author_Institution

Colorado State Univ., Fort Collins, CO, USA

Volume

18

Issue

9

fYear

2010

Firstpage

1376

Lastpage

1380

Abstract

In ultra-deep submicrometer (UDSM) technologies, the current paradigm of using copper (Cu) interconnects for on-chip global communication is rapidly becoming a serious performance bottleneck. In this paper, we perform a system level evaluation of Carbon Nanotube (CNT) interconnect alternatives that may replace conventional Cu interconnects. Our analysis explores the impact of using CNT global interconnects on the performance and energy consumption of several multi-core chip multiprocessor (CMP) applications. Results from our analysis indicate that with improvements in fabrication technology, CNT-based global interconnects can significantly outperform Cu-based global interconnects.

Keywords

carbon nanotubes; integrated circuit design; integrated circuit interconnections; microprocessor chips; multiprocessing systems; CNT global interconnects; Cu-based global interconnects; UDSM technology; carbon nanotube global interconnect evaluation; copper interconnects; energy consumption; multicore chip multiprocessor; on-chip global communication; system level evaluation; ultra-deep submicrometer technology; Carbon nanotubes; Conductivity; Copper; Crosstalk; Electromigration; Energy consumption; Global communication; Integrated circuit interconnections; Propagation delay; RLC circuits; Carbon nanotubes; chip multiprocessors; global interconnects; system level design;

fLanguage

English

Journal_Title

Very Large Scale Integration (VLSI) Systems, IEEE Transactions on

Publisher

ieee

ISSN

1063-8210

Type

jour

DOI

10.1109/TVLSI.2009.2024118

Filename

5208261