DocumentCode
1301586
Title
Analysis on Thermal Management Schemes of LED Backlight Units for Liquid Crystal Displays
Author
Kim, Sung Ki
Author_Institution
Mech. Solution Lab., Samsung Electron., Suwon, South Korea
Volume
2
Issue
11
fYear
2012
Firstpage
1838
Lastpage
1846
Abstract
Light-emitting diodes (LEDs), have emerged as a new light source for backlight units in novel liquid crystal displays due to their advantages in optical performance and their environmentally friendly features. The characteristics of LEDs, however, are inherently accompanied by high heat dissipation, and performance of an LED device strongly depends on the operating temperature. Therefore, proper thermal management is required to facilitate reliable operation of a backlight unit in a display, and analysis on thermal characteristics of backlight units is imperative for development of reliable thermal management. This paper aims to investigate thermal characteristics of the LED backlight unit according to thermal design parameters. The effects of a thermal management scheme on the maximum temperature of an LED and the temperature uniformity in both edge-light- and direct-light-type LED backlight units are scrutinized. Results demonstrated that the heat dissipation from an LED and the composite conductivity of a thermal scheme play a crucial role on the thermal performance of a unit, and the effect of composite conductivity varies according to the characteristics of a plane where light sources are installed.
Keywords
LED displays; cooling; light sources; liquid crystal displays; thermal management (packaging); composite conductivity; direct-light-type LED backlight unit; edge-light-type LED backlight unit; heat dissipation; light source; light-emitting diode; liquid crystal display; thermal design parameter; thermal management scheme analysis; Conductivity; Heat transfer; Heating; Light emitting diodes; Temperature; Thermal management; Light-emitting diode (LED); liquid crystal display (LCD) backlight unit; thermal management;
fLanguage
English
Journal_Title
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
2156-3950
Type
jour
DOI
10.1109/TCPMT.2012.2212901
Filename
6313895
Link To Document