DocumentCode :
1301592
Title :
Modeling Relative Humidity and Temperature Effects on Scattering Parameters in Transmission Lines
Author :
Agili, Sedig S. ; Morales, Aldo W. ; Li, Ji ; Resso, Michael
Author_Institution :
Dept. of Electr. Eng., Penn State Harrisburg, Middletown, PA, USA
Volume :
2
Issue :
11
fYear :
2012
Firstpage :
1847
Lastpage :
1858
Abstract :
This paper is focused on the development of a simulation method to evaluate relative humidity (RH) and temperature effects of scattering parameters on transmission systems from DC to 26 GHz. The first step in the analysis is to design a number of experiments to quantify the environmental impacts on S-parameters. Then, a method is proposed to model the RH and temperature effects on microstrip transmission lines, without the need for extensive and complex S-parameter data collection or the use of an environmental chamber. The proposed method was achieved after data analysis which included filtering, fitting, and interpolation, both in magnitude and phase of the S-parameters. The results show that the RH and temperature effects on transmission systems can be accurately modeled and predicted. This method can be applied to different printed circuit board materials, and it will be useful to engineers and manufacturers interested in predicting environmental impacts on system performance.
Keywords :
S-parameters; high-frequency transmission lines; microstrip lines; S-parameter data collection; data analysis; environmental chamber; environmental impacts; interpolation; microstrip transmission lines; printed circuit board materials; relative humidity evaluation; scattering parameters; temperature effects; transmission lines; Frequency measurement; Humidity; Materials; Microstrip; Moisture; Scattering parameters; Temperature measurement; Humidity and temperature effects; S-parameters; microstrip line; modeling;
fLanguage :
English
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
2156-3950
Type :
jour
DOI :
10.1109/TCPMT.2012.2210891
Filename :
6313896
Link To Document :
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