DocumentCode
1302180
Title
A Kink-Effect-Free Poly-Si Thin-Film Transistor With Current and Electric Field Split Structure Design
Author
Chien, Feng-Tso ; Chen, Yi-Ju
Author_Institution
Dept. of Electron. Eng., Feng-Chia Univ., Taichung, Taiwan
Volume
57
Issue
10
fYear
2010
Firstpage
2547
Lastpage
2555
Abstract
In this paper, we propose a high-performance kink-effect-free bottom-gated polycrystalline (poly-Si) thin-film transistor with a drain-extended field plate (FP) structure. The extended-drain FP can distribute the electric field to the channel near the drain area and, particularly, can change the electron current path. The altered current path leads to a high current density and high electric field split structure that reduces the impact ionization at the drain area. Our experimental results show that the on-current of the proposed device is higher than that of the conventional structure, and the kink effect as well as the leakage current is simultaneously improved. Moreover, the device stability, such as threshold voltage shift and transconductance degradation under a high gate bias, is enhanced by the proposed drain-extended FP design. The current and electric field split structure is also beneficial in scaling down the device size for a better performance.
Keywords
elemental semiconductors; impact ionisation; leakage currents; silicon; thin film transistors; Si; current density; current field split structure design; drain area; drain-extended FP structure; drain-extended field plate structure; electric field split structure design; electron current path; impact ionization; kink-effect-free polycrystalline thin film transistor; leakage current; threshold voltage shift; transconductance degradation; Charge carrier processes; Current density; Impact ionization; Intellectual property; Logic gates; Passivation; Thin film transistors; Field plate (FP); impact ionization; kink effect; thin-film transistor (TFT);
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2010.2063290
Filename
5555964
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