DocumentCode
1303074
Title
Si-based packaging platform for LED module using electroplating method
Author
Wang, Chingyue ; Lee, Woo Seung ; Zhang, Fang ; Kim, N.Y.
Author_Institution
RFIC Centre, Kwangwoon Univ., Seoul, South Korea
Volume
46
Issue
17
fYear
2010
Firstpage
1220
Lastpage
1221
Abstract
A method for fabricating a Si-based packaging platform with a reflector and electrode-guided interconnections is proposed for the packaging component of a high-power light-emitting diode (LED) module. The reflector is fabricated by Ni/Au/Ag-electroplating which is patterned by SU-8 2075 and 4620 negative photo-resistors and the electrical interconnections are formed by Cu/Au-electroplating in the same body. The heat generated by the LED chip is dissipated directly to the Si body through the large metal-plated platform. This method is suitable for high-efficiency and low-cost LED packaging.
Keywords
electronics packaging; electroplating; elemental semiconductors; light emitting diodes; photoresistors; semiconductor device metallisation; silicon; LED module; electrical interconnections; electrode-guided interconnections; electroplating method; high-power light-emitting diode module; negative photoresistors; packaging platform; reflector;
fLanguage
English
Journal_Title
Electronics Letters
Publisher
iet
ISSN
0013-5194
Type
jour
DOI
10.1049/el.2010.1798
Filename
5556100
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