• DocumentCode
    1303105
  • Title

    Characterization of Piezoresistive-Si-Nanowire-Based Pressure Sensors by Dynamic Cycling Test With Extralarge Compressive Strain

  • Author

    Lou, Liang ; Yan, Hongkang ; Park, Woo-Tae ; Kwong, Dim-Lee ; Lee, Chengkuo

  • Volume
    59
  • Issue
    11
  • fYear
    2012
  • Firstpage
    3097
  • Lastpage
    3103
  • Abstract
    A novel pressure sensor using piezoresistive silicon nanowires (SiNWs) embedded in a suspended multilayered diaphragm is investigated by a probe-based dynamic cycling test combining the standard bulge testing setup. By utilizing the high fracture stress of the SiNx film, we explored the behavior of the SiNW under a level of extralarge compressive strain for the first time, including strain levels of more than 2.1% under the static testing and 1.5% under the dynamic testing. Drift of the initial resistances of the SiNW was observed at different time intervals during the dynamic testing under a compressive strain of higher than 1.3%, while the sensitivity of the pressure sensor basically keeps unchanged. However, there was almost no drift or degradation observed in the sensor characteristics when an equivalent point loading within the application working range is applied to the pressure sensor during the dynamic testing.
  • Keywords
    compressive strength; diaphragms; dynamic testing; elemental semiconductors; fracture toughness testing; nanosensors; nanowires; piezoresistive devices; pressure sensors; semiconductor quantum wires; sensitivity; silicon; Si; SiNW; extralarge compressive strain; high fracture stress utilization; piezoresistive silicon nanowires; point loading; pressure sensor; probe-based dynamic cycling test; sensitivity; sensor characteristics; standard bulge testing setup; static testing; suspended multilayered diaphragm; Nanowires; Piezoelectric materials; Resistance; Sensor phenomena and characterization; Strain; Testing; Fatigue; large compressive strain; piezoresistive; pressure sensor; silicon nanowire (SiNW);
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2012.2214440
  • Filename
    6316138