• DocumentCode
    1304414
  • Title

    Reliability-Enhancement and Self-Repair Schemes for SRAMs With Static and Dynamic Faults

  • Author

    Li, Jin-Fu ; Tseng, Tsu-Wei ; Hou, Chih-Sheng

  • Author_Institution
    Dept. of Electr. Eng., Nat. Central Univ., Jhongli, Taiwan
  • Volume
    18
  • Issue
    9
  • fYear
    2010
  • Firstpage
    1361
  • Lastpage
    1366
  • Abstract
    This paper proposes a simple method for enhancing the reliability of static random access memories (SRAMs) with hard-to-detect resistive-open defects. The method prevents a SRAM from executing successive multiple read operations on the same position, such that the hard-to-detect defects cannot manifest as functional faults. This can prolong the lifetime of the SRAM with latent hard-to-detect defects. Experimental results show that the proposed reliability-enhancement circuit (REC) can effectively improve the reliability of the SRAMs without incurring delay penalty and with 0.07% additional area cost for an 8192 × 64-bit SRAM. By integrating the REC with the SRAM, a BISR scheme is proposed to boost 6%-10% increment of repair rate compared with the BISR without the REC. Also, the area cost of the BISR is low-only about 2% for an 8192 × 64-bit SRAM.
  • Keywords
    SRAM chips; integrated circuit reliability; BISR scheme; SRAM; dynamic faults; hard-to-detect resistive-open defects; reliability-enhancement circuit; self-repair schemes; static faults; static random access memories; Built-in self-test; Circuit faults; Costs; Electrical fault detection; Fault detection; Integrated circuit reliability; Random access memory; Read-write memory; SRAM chips; Testing; Random access memories; built-in self-repair; built-in self-test; dynamic faults; march test; reliability; static faults;
  • fLanguage
    English
  • Journal_Title
    Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1063-8210
  • Type

    jour

  • DOI
    10.1109/TVLSI.2009.2022363
  • Filename
    5210133