Title :
Carbon Nanotube Yarns for Deep Brain Stimulation Electrode
Author :
Jiang, Changqing ; Li, Luming ; Hao, Hongwei
Author_Institution :
Sch. of Aerosp., Tsinghua Univ., Beijing, China
Abstract :
A new form of deep brain stimulation (DBS) electrode was proposed that was made of carbon nanotube yarns (CNTYs). Electrode interface properties were examined using cyclic voltammetry (CV) and electrochemical impedance spectrum (EIS). The CNTY electrode interface exhibited large charge storage capacity (CSC) of 12.3 mC/cm2 which increased to 98.6 mC/cm2 after acid treatment, compared with 5.0 mC/cm2 of Pt-Ir. Impedance spectrum of both untreated and treated CNTY electrodes showed that finite diffusion process occurred at the interface due to their porous structure and charge was delivered through capacitive mechanism. To evaluate stability electrical stimulus was exerted for up to 72 h and CV and EIS results of CNTY electrodes revealed little alteration. Therefore CNTY could make a good electrode material for DBS.
Keywords :
bioelectric phenomena; biomedical electrodes; biomedical materials; brain; carbon nanotubes; diffusion; electrochemical impedance spectroscopy; iridium; nanomedicine; patient treatment; platinum; porosity; voltammetry (chemical analysis); yarn; C; EIS; Pt-Ir; acid treatment; capacitive mechanism; carbon nanotube yarns; charge storage capacity; cyclic voltammetry; deep brain stimulation electrode; electrochemical impedance spectrum; finite diffusion process; impedance spectrum; porous structure; stability electrical stimulus; Brain modeling; Carbon nanotubes; Electrodes; Impedance; Surface impedance; Surface treatment; Carbon nanotube yarn (CNTY); deep brain stimulation (DBS); electrode interface; Algorithms; Deep Brain Stimulation; Electric Impedance; Electrochemistry; Electrodes; Electronics; Equipment Design; Humans; Iridium; Materials Testing; Microscopy, Electron, Scanning; Nanotubes, Carbon; Neurons; Oxidation-Reduction; Platinum; Porosity;
Journal_Title :
Neural Systems and Rehabilitation Engineering, IEEE Transactions on
DOI :
10.1109/TNSRE.2011.2165733