Title :
Analytical heat transfer model for three-dimensional integrated circuits incorporating through silicon via effect - RETRACTED
Author :
Libo Qian ; Zhangming Zhu
Author_Institution :
Sch. of Microelectron., Xidian Univ., Xi´an, China
Keywords :
finite element analysis; heat transfer; silicon; thermal conductivity; three-dimensional integrated circuits; vias; 3D IC; 3D finite element simulation; 3D integrated circuit; Si; TSV effect; analytical heat transfer model; insertion density; multiplane stack; temperature profile; thermal conductivity; thermal performance; through silicon via effect; via density;
Journal_Title :
Micro & Nano Letters, IET
DOI :
10.1049/mnl.2012.0598
