• DocumentCode
    1304994
  • Title

    Analytical heat transfer model for three-dimensional integrated circuits incorporating through silicon via effect - RETRACTED

  • Author

    Libo Qian ; Zhangming Zhu

  • Author_Institution
    Sch. of Microelectron., Xidian Univ., Xi´an, China
  • Volume
    7
  • Issue
    9
  • fYear
    2012
  • Firstpage
    994
  • Lastpage
    996
  • Abstract
    RETRACTED
  • Keywords
    finite element analysis; heat transfer; silicon; thermal conductivity; three-dimensional integrated circuits; vias; 3D IC; 3D finite element simulation; 3D integrated circuit; Si; TSV effect; analytical heat transfer model; insertion density; multiplane stack; temperature profile; thermal conductivity; thermal performance; through silicon via effect; via density;
  • fLanguage
    English
  • Journal_Title
    Micro & Nano Letters, IET
  • Publisher
    iet
  • ISSN
    1750-0443
  • Type

    jour

  • DOI
    10.1049/mnl.2012.0598
  • Filename
    6319628
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1304994