Title :
Hybrid MOSFET/driver for ultra-fast switching
Author :
Tang, T. ; Burkhart, C.
Author_Institution :
Stanford Linear Accel. Center, Menlo Park, CA, USA
fDate :
8/1/2009 12:00:00 AM
Abstract :
The ultra-fast switching of power MOSFETs, in about 1 ns, is very challenging. This is largely due to the parasitic inductance that is intrinsic to commercial packages used for both MOSFETs and drivers. Parasitic gate and source inductance not only limit the voltage rise time on the MOSFET internal gate structure but can also cause the gate voltage to oscillate. This paper describes a hybrid approach that substantially reduces the parasitic inductance between the driver and MOSFET gate, as well as between the MOSFET source and its external connection. A flip-chip assembly is used to directly attach a die-form power MOSFET and driver on a PCB. The parasitic inductances are significantly reduced by eliminating bond wires and minimizing lead length. The experimental results demonstrate ultra-fast switching of the power MOSFET with excellent control of the gate-source voltage.
Keywords :
flip-chip devices; power MOSFET; printed circuits; MOSFET internal gate structure; MOSFET source; die-form power MOSFET; flip-chip assembly; gate-source voltage; hybrid MOSFET-driver; parasitic gate; parasitic inductance; ultrafast switching; Assembly; Bonding; Driver circuits; Inductance; MOSFET circuits; Packaging; Power MOSFET; Switching circuits; Voltage; Wires; MOSFET switches, power MOSFETs, high-speed electronics, pulse power system switches, Hybrid integrated circuits, flip-chip devices.;
Journal_Title :
Dielectrics and Electrical Insulation, IEEE Transactions on
DOI :
10.1109/TDEI.2009.5211841