• DocumentCode
    130544
  • Title

    A new extraction method of extrinsic elements of GaAs/GaN HEMTs

  • Author

    Andong Huang ; Zheng Zhong ; Yongxin Guo ; Wen Wu

  • Author_Institution
    Nanjing Univ. of Sci. & Technol., Nanjing, China
  • fYear
    2014
  • fDate
    27-30 Aug. 2014
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    A new extraction approach of extrinsic parameters of GaAs/GaN HEMTs is present. This method is able to extract the extrinsic elements from just one set of S-parameters under weakly pinch off condition which biases the gate with a voltage slightly below the pinch off point, thus avoids any gate degradation and additional relationship for determining parasitic resistances in the conventional method. Since the internal part is extremely simplified at this bias condition, artificial bee colony algorithm (ABC) is employed to optimize the reduced equivalent circuit parameters (ECPs) to achieve good agreement between the simulated and measured S-parameters. The extraction is fast, robust and with satisfying accuracy. Moreover, this method can be easily extended to different transistor devices with various semiconductor manufacturing processes and external topologies. This method is verified by 2×50 um GaAs HEMT at 99 bias points from 1 GHz to 50 GHz.
  • Keywords
    III-V semiconductors; S-parameters; equivalent circuits; gallium arsenide; gallium compounds; high electron mobility transistors; wide band gap semiconductors; GaAs-GaN; HEMT; S-parameters; artificial bee colony algorithm; equivalent circuit parameters; extraction method; extrinsic elements; frequency 1 GHz to 50 GHz; parasitic resistances; size 100 mum; weakly pinch off condition; Equivalent circuits; Gallium arsenide; HEMTs; Logic gates; MODFETs; Scattering parameters; Semiconductor device measurement; GaAs/GaN HEMT; artificial bee colony; parameter extraction; weakly pinch off;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Radio-Frequency Integration Technology (RFIT), 2014 IEEE International Symposium on
  • Conference_Location
    Hefei
  • Type

    conf

  • DOI
    10.1109/RFIT.2014.6933249
  • Filename
    6933249