DocumentCode
1305570
Title
Study of temperature rise of metallized capacitors applied in repetitive pulse
Author
Kong, Zhonghua ; Dai, Ling ; Lin, Fuchang ; Li, Hua ; Jang, Yadong
Author_Institution
State Key Lab. of Electonic Thin Film & Integrated Devices, Univ. of Electron. Sci. & Technol. of China, Chengdu, China
Volume
16
Issue
4
fYear
2009
fDate
8/1/2009 12:00:00 AM
Firstpage
1100
Lastpage
1105
Abstract
When metallized capacitors are applied to pulsed power applications with frequency less than 1 Hz, heat induced by current can be ignored. However, it is necessary to consider the accumulation effect of heat on temperature rise of capacitors which are applied to repetitive pulsed systems. The paper mainly study the influence of frequency and line current density on temperature rise of metallized capacitors applied to repetitive pulsed systems. The experiment results show that temperature increases with line current density and frequency increasing, and when surface temperature of capacitor is higher than 110degC, the melted PP film would blow out from the middle location of capacitors, and the highest temperature in the capacitor is calculated. The capacitor segment location and line current density on the single discharge energy of the capacitor are influenced and has been analyzed by ATP. Temperature rise of each segment location of capacitor caused by single discharge was calculated, the results show that temperature rise is very small.
Keywords
current density; discharges (electric); power capacitors; pulsed power technology; ATP analysis; accumulation effect; melted PP film; metallized capacitor; repetitive pulsed power system; single discharge energy; temperature rise current density; Breakdown voltage; Capacitors; Current density; Dielectrics; Fault location; Filters; Frequency; Metallization; Temperature distribution; Thermal stresses; Metallized capacitor, repetitive pulse, temperature rise, ATP.;
fLanguage
English
Journal_Title
Dielectrics and Electrical Insulation, IEEE Transactions on
Publisher
ieee
ISSN
1070-9878
Type
jour
DOI
10.1109/TDEI.2009.5211861
Filename
5211861
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