Title :
Three-dimensional micro-channel fabrication in polydimethylsiloxane (PDMS) elastomer
Author :
Jo, Byung-Ho ; Van Lerberghe, Linda M. ; Motsegood, Kathleen M. ; Beebe, David J.
Author_Institution :
Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
fDate :
3/1/2000 12:00:00 AM
Abstract :
This paper describes a fabrication technique for building three-dimensional (3-D) micro-channels in polydimethylsiloxane (PDMS) elastomer. The process allows for the stacking of many thin (less than 100-/spl mu/m thick) patterned PDMS layers to realize complex 3-D channel paths. The master for each layer is formed on a silicon wafer using an epoxy-based photoresist (SU 8). PDMS is cast against the master producing molded layers containing channels and openings. To realize thin layers with openings, a sandwich molding configuration was developed that allows precise control of the PDMS thickness. The master wafer is clamped within a sandwich that includes flat aluminum plates, a flexible polyester film layer, a rigid Pyrex wafer, and a rubber sheet. A parametric study is performed on PDMS surface activation in a reactive-ion-etching system and the subsequent methanol treatment for bonding and aligning very thin individual components to a substrate. Low RF power and short treatment times are better than high RF power and long treatment times, respectively, for instant bonding. Layer-to-layer alignment of less then 15 /spl mu/m is achieved with manual alignment techniques that utilize surface tension driven self-alignment methods. A coring procedure is used to realize off-chip fluidic connections via the bottom PDMS layer, allowing the top layer to remain smooth and flat for complete optical access.
Keywords :
elastomers; microfluidics; micromachining; moulding; photoresists; sputter etching; wafer bonding; Al; PDMS elastomer; Si; bonding; complex 3-D channel paths; coring procedure; epoxy-based photoresist; flexible polyester film layer; layer-to-layer alignment; methanol treatment; molded layers; off-chip fluidic connections; parametric study; polydimethylsiloxane; reactive-ion-etching system; rigid Pyrex wafer; rubber sheet; sandwich molding configuration; silicon wafer; stacking; surface activation; surface tension driven self-alignment methods; three-dimensional micro-channel fabrication; Aluminum; Fabrication; Parametric study; Radio frequency; Resists; Rubber; Silicon; Stacking; Surface treatment; Thickness control;
Journal_Title :
Microelectromechanical Systems, Journal of