DocumentCode :
1305758
Title :
Microfabricated small metal cantilevers with silicon tip for atomic force microscopy
Author :
Chand, Ami ; Viani, Mario B. ; Schaffer, Tilman E. ; Hansma, Paul K.
Author_Institution :
Veeco Metrol. Group, Digital Instrum. Inc., Santa Barbara, CA, USA
Volume :
9
Issue :
1
fYear :
2000
fDate :
3/1/2000 12:00:00 AM
Firstpage :
112
Lastpage :
116
Abstract :
Atomic force microscopy with small cantilevers is faster due to higher resonant frequencies and has a lower noise level. We report a new process to microfabricate small metal cantilevers with integrated silicon tips. This process is used to fabricate gold cantilevers that are 13-40-/spl mu/m long, 5-10-/spl mu/m wide, and 100-160-nm thick. The tip is first formed at the free end of a sacrificial oxide cantilever. The cantilever layer of the desired metal is then deposited on the nontip side of the sacrificial oxide cantilever. The oxide layer is removed to form the cantilevers with tips on them in a batch process. The highly stressed cantilevers are rapid thermal annealed for 60 s at 300/spl deg/C to relieve the stress. The gold cantilevers have been characterized through their thermal spectra and used to image in tapping mode. The process can be used, not only for gold, but also for any metal or compound that can withstand removal of sacrificial oxide cantilevers.
Keywords :
atomic force microscopy; elemental semiconductors; gold; micromachining; rapid thermal annealing; silicon; stress relaxation; 100 to 160 nm; 13 to 40 mum; 300 C; 5 to 10 mum; 60 s; Au; Si; atomic force microscopy; batch process; gold cantilevers; integrated silicon tips; microfabricated small metal cantilevers; microfabrication; noise level; rapid thermal annealing; resonant frequencies; sacrificial oxide cantilever; silicon tip; tapping mode; thermal spectra; Atomic force microscopy; Fabrication; Gold; Rapid thermal processing; Resonant frequency; Silicon; Springs; Surface topography; Temperature sensors; Thermal stresses;
fLanguage :
English
Journal_Title :
Microelectromechanical Systems, Journal of
Publisher :
ieee
ISSN :
1057-7157
Type :
jour
DOI :
10.1109/84.825785
Filename :
825785
Link To Document :
بازگشت