DocumentCode :
1305787
Title :
Self-buckling of micromachined beams under resistive heating
Author :
Chiao, Mu ; Lin, Liwei
Author_Institution :
Dept. of Mech. Eng., California Univ., Berkeley, CA, USA
Volume :
9
Issue :
1
fYear :
2000
fDate :
3/1/2000 12:00:00 AM
Firstpage :
146
Lastpage :
151
Abstract :
Self-buckling behavior of micromachined beams under resistive heating is described by an electromechanical model with experimental verifications. This model consists of both electrothermal and thermoelastic analyses for beam-shape polysilicon microstructures that are fabricated by a standard surface micromachining process. When an input electrical current is applied, Joule-heating effects trigger the thermal expansion of beam structures and cause mechanical buckling. The standard testing devices are clamped-clamped bridges, 2-/spl mu/m wide, 2-/spl mu/m thick, and 100-/spl mu/m long. It is found that a minimum current of 3.5 mA is required to cause beam buckling. Under an input current of 4.8 mA, a lateral deflection of 2.9/spl plusmn/0.2 /spl mu/m at the center of the bridge is measured with a computer image processing scheme. The experimental measurements are found to be consistent with analytical predictions. A discussion of modeling considerations and process variations is presented.
Keywords :
buckling; microactuators; resistance heating; semiconductor device models; silicon; temperature distribution; thermal expansion; thermal stresses; thermoelasticity; 100 micron; 2 micron; 3.5 mA; 4.8 mA; Joule-heating effects; Si; beam-shape polysilicon microstructures; clamped-clamped bridges; electromechanical model; electrothermal analysis; lateral deflection; mechanical buckling; micromachined beams; post-buckling; process variations; resistive heating; self-buckling; surface micromachining; temperature distribution; thermal expansion; thermoelastic analysis; Bridges; Current measurement; Electrothermal effects; Heating; Image processing; Micromachining; Microstructure; Testing; Thermal expansion; Thermoelasticity;
fLanguage :
English
Journal_Title :
Microelectromechanical Systems, Journal of
Publisher :
ieee
ISSN :
1057-7157
Type :
jour
DOI :
10.1109/84.825789
Filename :
825789
Link To Document :
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