• DocumentCode
    1306801
  • Title

    Purposes of three-dimensional circuits

  • Author

    Terao, Akira ; Van de Wiele, Fernand

  • Author_Institution
    Catholic Univ., Louvain-la-Neuve, Belgium
  • Volume
    3
  • Issue
    6
  • fYear
    1987
  • Firstpage
    31
  • Lastpage
    33
  • Abstract
    Three-dimensional (3-D) circuitry is a recognized concept. With the advent of silicon-on-insulator (SOI) technologies, this idea is being realized using techniques such as laser recrystallization of polysilicon, which allows fabrication of active devices stacked in two or more layers. Since silicon is a well-known microelectronic material, progress has been very fast and some laboratories have already succeeded in producing three-dimensional circuit cells [1]-[3]. In order to focus activity and rationally optimize products, technologists need to know the types of circuits required. This paper examines the problem from several points of view and tries to answer three fundamental questions: (1) What are the main advantages of 3-D circuitry? (2) What kind of circuits will yield best advantages? (3) Which technological problems have priority?
  • fLanguage
    English
  • Journal_Title
    Circuits and Devices Magazine, IEEE
  • Publisher
    ieee
  • ISSN
    8755-3996
  • Type

    jour

  • DOI
    10.1109/MCD.1987.6323178
  • Filename
    6323178