DocumentCode
1306996
Title
Characterization of Inversion-Layer Capacitance of Electrons in High-
/Metal Gate Stacks
Author
Iijima, Ryosuke ; Edge, Lisa F. ; Paruchuri, Vamsi ; Takayanagi, Mariko
Author_Institution
Toshiba America Electron. Components, Inc., Albany, NY, USA
Volume
57
Issue
11
fYear
2010
Firstpage
2814
Lastpage
2820
Abstract
The inversion-layer capacitance Cinv of electrons in high-k/metal gate stacks (HKMGs) is studied theoretically and experimentally from the viewpoint of the penetration of electrons into the dielectrics. The numerical calculation of Cinv in the dielectric/substrate bilayer structure has clarified the influence of penetration on Cinv . Cinv in an HKMG is evaluated experimentally and is compared with the computational predictions in terms of the dependence on the dielectric boundary and the silicon crystal orientation. The consistency of the experiment and the calculation is the first evidence for the considerable modulation of Cinv due to penetration in the actual HKMG. Moreover, the dependence of Cinv on substrate biasing is investigated. The detailed analysis of Cinv in the system where the confinement of the inversion layer is intentionally changed has led to a further understanding of Cinv determined by penetration.
Keywords
MOSFET; capacitance; electron density; elemental semiconductors; hafnium compounds; high-k dielectric thin films; inversion layers; semiconductor device measurement; semiconductor device models; silicon; titanium compounds; HfO2-TiN; MOSFET; Si; dielectric boundary; dielectric-substrate bilayer structure; electron penetration; high-k metal gate stacks; inversion-layer capacitance; silicon crystal orientation; silicon substrates; Capacitance; Dielectrics; High K dielectric materials; MOSFETs; Silicon; Substrates; Equivalent oxide thickness; gate capacitance; high- $k$ dielectric; high- $k$ /metal gate stack (HKMG); inversion layer; metal gate; metal–oxide–semiconductor field-effect transistor (MOSFET); penetration;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2010.2064317
Filename
5559392
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