Surface mount technology — The future of electronic assembly

The transition made over the last 20 years from vacuum tubes to integrated circuits will probably never be matched as far as a significant size reduction. But, the competitive nature of the semiconductor industry has continuously driven vendors to minimize the size of electronic components so that more functions can be achieved in a given volume. In addition, improved electrical performance, decreased mass, and the potential for a lower system cost are all by-products of compact packaging and circuitry, which holds the interest of component manufacturers and users alike.