• DocumentCode
    1307139
  • Title

    Introduction to the issue on alignment tolerant structures for ease of optoelectronic packaging

  • Author

    Collins, J.V. ; Dagenais, Mario ; Itoh, M.

  • Author_Institution
    British Telecom Res. Labs., Ipswich
  • Volume
    3
  • Issue
    6
  • fYear
    1998
  • fDate
    12/1/1998 12:00:00 AM
  • Firstpage
    1306
  • Lastpage
    1307
  • Abstract
    Is an introduction on a special issue on optoelectronic packaging scientific articles
  • Keywords
    integrated circuit packaging; integrated optoelectronics; optoelectronic devices; alignment tolerant structures; optoelectronic packaging; scientific articles; special issue; Costs; Educational institutions; Electronics packaging; Integrated optoelectronics; Laboratories; Optical switches; Optoelectronic devices; Semiconductor device packaging; Semiconductor laser arrays; Wavelength division multiplexing;
  • fLanguage
    English
  • Journal_Title
    Selected Topics in Quantum Electronics, IEEE Journal of
  • Publisher
    ieee
  • ISSN
    1077-260X
  • Type

    jour

  • DOI
    10.1109/2944.658784
  • Filename
    658784
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1307139