Title :
Introduction to the issue on alignment tolerant structures for ease of optoelectronic packaging
Author :
Collins, J.V. ; Dagenais, Mario ; Itoh, M.
Author_Institution :
British Telecom Res. Labs., Ipswich
fDate :
12/1/1998 12:00:00 AM
Abstract :
Is an introduction on a special issue on optoelectronic packaging scientific articles
Keywords :
integrated circuit packaging; integrated optoelectronics; optoelectronic devices; alignment tolerant structures; optoelectronic packaging; scientific articles; special issue; Costs; Educational institutions; Electronics packaging; Integrated optoelectronics; Laboratories; Optical switches; Optoelectronic devices; Semiconductor device packaging; Semiconductor laser arrays; Wavelength division multiplexing;
Journal_Title :
Selected Topics in Quantum Electronics, IEEE Journal of
DOI :
10.1109/2944.658784
