A review on fabrication technologies for the monolithic integration of tapers with III-V semiconductor devices

Author

Moerman, Ingrid ; Van Daele, Peter P. ; Demeester, Piet M.

Author_Institution

Dept. of Inf. Technol., Ghent Univ., Belgium

Volume

3

Issue

6

fYear

1998

fDate

12/1/1998 12:00:00 AM

Firstpage

1308

Lastpage

1320

Abstract

The past few years a lot of effort has been put in the development and fabrication of III-V semiconductor waveguiding devices with monolithic integrated mode size converters (tapers). By integrating a taper with a waveguide device, the coupling losses and the packaging cost of OEICs in future fiber-optical networks can be much reduced. This paper gives an overview of different taper designs, the possible fabrication technologies and performances of tapered devices

Keywords

integrated circuit packaging; integrated optoelectronics; optical communication equipment; optical fabrication; optical waveguides; reviews; III-V semiconductor devices; III-V semiconductor waveguiding devices; OEIC; coupling losses; fabrication technologies; fiber-optical networks; monolithic integrated mode size converters; monolithic integration; packaging cost; review; taper designs; tapered devices; tapers; Costs; Fabrication; III-V semiconductor materials; Monolithic integrated circuits; Optical fiber devices; Optical refraction; Optical variables control; Optical waveguides; Semiconductor device packaging; Semiconductor waveguides;

fLanguage

English

Journal_Title

Selected Topics in Quantum Electronics, IEEE Journal of

Publisher

ieee

ISSN

1077-260X

Type

jour

DOI

10.1109/2944.658785

Filename

658785