DocumentCode :
1307326
Title :
Temperature Sensor in a Flexible Substrate
Author :
Ahmed, Moinuddin ; Chitteboyina, Murali M. ; Butler, Donald P. ; Celik-Butler, Zeynep
Author_Institution :
Dept. of Electr. Eng., Univ. of Texas at Arlington, Arlington, TX, USA
Volume :
12
Issue :
5
fYear :
2012
fDate :
5/1/2012 12:00:00 AM
Firstpage :
864
Lastpage :
869
Abstract :
This paper presents the fabrication and measured performance of temperature sensors embedded in flexible polyimide substrates. The sensing material used for the temperature sensor was undoped amorphous silicon which was fabricated on a 35-m-thick layer of polyimide that serves as the flexible substrate. Another flexible polyimide superstrate layer of 35-40 m was spin-coated on top of the sensors to make sure the temperature sensors lie on a zero stress plane. The temperature coefficient of resistance was measured over the temperature range of 200- 360 K. The maximum temperature coefficient of resistance at 30 C was measured to be 0.0288 K-1. The effect of the flicker noise and voltage dependence of the voltage noise power spectral density exhibited by the sensor was evaluated. The normalized flicker noise coefficient was found to be 1.2 × 10-11.
Keywords :
flicker noise; temperature sensors; flexible polyimide substrates; normalized flicker noise coefficient; size 35 mum to 40 mum; temperature 200 K to 360 K; temperature 30 degC; temperature sensor; undoped amorphous silicon; voltage noise power spectral density; Noise; Resistance; Silicon; Substrates; Temperature measurement; Temperature sensors; Flexible substrate; flicker noise; temperature coefficient of resistance; temperature sensor;
fLanguage :
English
Journal_Title :
Sensors Journal, IEEE
Publisher :
ieee
ISSN :
1530-437X
Type :
jour
DOI :
10.1109/JSEN.2011.2166064
Filename :
5999683
Link To Document :
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