Ultra-thin electronic device package

Author

Chen, Kevin Y. ; Zenner, Robert L D ; Ameson, M. ; Mountain, David

Author_Institution

3M Co., Maplewood, MN, USA

Volume

23

Issue

1

fYear

2000

fDate

2/1/2000 12:00:00 AM

Firstpage

22

Lastpage

26

Abstract

We report in this article a feasibility study of ultra-thin device packages. These packages combine thin integrated circuit chips, thin flex circuitry, and adhesive flip-chip technologies. Using this novel packaging concept, we constructed 512 kb SRAM memory modules that were less than 150 micron thick. Even more profound, the package was flexible enough to conform to nonplanar surfaces. This unique property can lead to new applications that would not be feasible otherwise and extend the reach of electronics into brand new areas. Two of these ultra-thin modules were stacked to construct a 3D package with 1 Mbyte of memory capacity that is approximately 30 times thinner and 30 times lighter than a conventionally packaged device

Keywords

SRAM chips; adhesives; flip-chip devices; integrated circuit packaging; multichip modules; 150 micron; 3D package; SRAM memory modules; adhesive flip-chip technologies; flex circuitry; memory capacity; nonplanar surfaces; ultra-thin electronic device package; Assembly; Bonding; Chip scale packaging; Consumer electronics; Electronics packaging; Integrated circuit interconnections; Integrated circuit packaging; Integrated circuit technology; Random access memory; Silicon;

fLanguage

English

Journal_Title

Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1521-3323

Type

jour

DOI

10.1109/6040.826758

Filename

826758