DocumentCode :
1307973
Title :
Correction to "Die-cracking and reliable die design for flip-chip assemblies"
Author :
Sitaraman, Suresh K.
Volume :
23
Issue :
1
fYear :
2000
Firstpage :
121
Lastpage :
121
Keywords :
Assembly; Silicon;
fLanguage :
English
Journal_Title :
Advanced Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3323
Type :
jour
DOI :
10.1109/TADVP.2000.826770
Filename :
826770
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1307973
