DocumentCode

1307973

Title

Correction to "Die-cracking and reliable die design for flip-chip assemblies"

Author

Sitaraman, Suresh K.

Volume

23

Issue

1

fYear

2000

Firstpage

121

Lastpage

121

Keywords

Assembly; Silicon;

fLanguage

English

Journal_Title

Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1521-3323

Type

jour

DOI

10.1109/TADVP.2000.826770

Filename

826770