DocumentCode :
1308381
Title :
Au/In/Pd/Te/Pd ohmic contact to n-GaSb
Author :
Yang, Z.C. ; Hao, P.H. ; Wang, L.C.
Author_Institution :
Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA
Volume :
32
Issue :
25
fYear :
1996
fDate :
12/5/1996 12:00:00 AM
Firstpage :
2348
Lastpage :
2349
Abstract :
An Au/In/Pd/Te/Pd ohmic contact scheme has been developed to n-GaSb (n≃1018 cm-3). Annealed at 250 and 400°C, this contact scheme exhibits excellent electrical properties (contact resistivity <10-6 Ω-cm2) and good thermal stability. The surface and interface morphologies were investigated using a scanning electron microscope (SEM). The ohmic contact formation mechanism is also proposed
Keywords :
III-V semiconductors; annealing; contact resistance; gallium compounds; gold; indium; interface structure; ohmic contacts; palladium; scanning electron microscopy; semiconductor device metallisation; semiconductor-metal boundaries; surface structure; tellurium; thermal stability; 250 C; 400 C; Au-In-Pd-Te-Pd-GaSb; Au/In/Pd/Te/Pd ohmic contact; GaSb; annealing; contact resistivity; electrical properties; interface morphology; n-GaSb; ohmic contact formation mechanism; scanning electron microscope; surface morphology; thermal stability;
fLanguage :
English
Journal_Title :
Electronics Letters
Publisher :
iet
ISSN :
0013-5194
Type :
jour
DOI :
10.1049/el:19961589
Filename :
555971
Link To Document :
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