DocumentCode
1308467
Title
Yield improvement of a large area magnetic field sensor array using redundancy schemes
Author
Audet, Yves ; Chapman, Glenn H.
Author_Institution
Sch. of Eng. Sci., Simon Fraser Univ., Burnaby, BC, Canada
Volume
5
Issue
1
fYear
1997
fDate
3/1/1997 12:00:00 AM
Firstpage
28
Lastpage
33
Abstract
The circuit design of a large area magnetic field sensor array (LAMSA) is described. This prototype is developed for applications in magnetic field mapping and tactile sensor arrays. To enable the production of such a large sensor system, redundancy schemes are implemented and a laser interconnection post fabrication technique is used for fault repairs. The design restructurable capabilities rely on local redundancy schemes for the sensor grid and global redundancy schemes for the surrounding control circuits. Experimental results obtained on a laser restructurable subarray of magnetic field sensor cells are shown. A study of the robustness of the local sensor grid redundancy schemes is presented.
Keywords
integrated circuit interconnections; integrated circuit yield; laser beam applications; magnetic field measurement; magnetic sensors; redundancy; tactile sensors; wafer-scale integration; LAMSA; control circuits; design restructurable capabilities; fault repairs; global redundancy schemes; large area magnetic field sensor array; laser interconnection post fabrication technique; laser restructurable subarray; local redundancy schemes; magnetic field mapping; redundancy schemes; sensor grid; tactile sensor arrays; yield improvement; Circuit synthesis; Integrated circuit interconnections; Magnetic sensors; Production systems; Prototypes; Redundancy; Sensor arrays; Sensor phenomena and characterization; Sensor systems; Tactile sensors;
fLanguage
English
Journal_Title
Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
Publisher
ieee
ISSN
1063-8210
Type
jour
DOI
10.1109/92.555984
Filename
555984
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