Title :
A semianalytical parameter extraction of a SPICE BSIM3v3 for RF MOSFET´s using S-parameters
Author :
Lee, Seonghearn ; Yu, Hyun Kyu
Author_Institution :
Dept. of Electron. Eng., Hankuk Univ. of Foreign Studies, Kyungkido, South Korea
fDate :
3/1/2000 12:00:00 AM
Abstract :
In this paper, we present a new parameter-extraction method combining analytical and optimization approaches for the RF large-signal Berkeley Short-Channel IGFET Model 3, Version 3.0. Using S-parameters of MOSFET´s with different channel lengths and widths at zero gate bias, all overlap capacitances are accurately determined in the high-frequency range. The junction-capacitance model parameters are extracted using S-parameters of devices with different perimeter-to-area ratios at two different biases of zero and high voltages. A robust technique utilizing simple Z-parameter equations is also used to extract resistances (Rg and Rd) and inductances. The source and substrate resistances are initially determined using the zero-bias optimization, and their uncertainties are subsequently eliminated in the normal-bias optimization. Good agreements between measured and modeled S-parameters from 0.5 to 12 GHz demonstrate the validity of this semianalytical method
Keywords :
MOSFET; S-parameters; SPICE; UHF field effect transistors; capacitance; electric resistance; inductance; microwave field effect transistors; semiconductor device models; 0.5 to 12 GHz; RF MOSFET; S-parameters; SPICE BSIM3v3; Z-parameter equations; high-frequency range; inductances; junction-capacitance model parameters; large-signal Berkeley Short-Channel IGFET Model 3; normal-bias optimization; optimization approach; overlap capacitances; perimeter-to-area ratios; resistances; semianalytical parameter extraction; source resistance; substrate resistances; zero-bias optimization; Capacitance; Electrical resistance measurement; Equations; Optimization methods; Parameter extraction; Radio frequency; Robustness; SPICE; Scattering parameters; Voltage;
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on