DocumentCode :
1308817
Title :
Charge collection in submicron CMOS/SOI technology
Author :
Musseau, O. ; Ferlet-Cavrois, V. ; Campbell, A.B. ; Knudson, A.R. ; Stapor, W.J. ; McDonald, P.T. ; Pelloie, J.L. ; Raynaud, C.
Author_Institution :
CEA, Centre d´´Etudes de Bruyeres-le-Chatel, France
Volume :
44
Issue :
6
fYear :
1997
fDate :
12/1/1997 12:00:00 AM
Firstpage :
2124
Lastpage :
2133
Abstract :
We present experimental measurements of charge collection spectroscopy from high energy ion strikes in submicron CMOS/SOI devices. Due to the specific structure of SOI technology, with symmetrical source and drain junctions, a direct equivalence between upset mechanism and charge collection is established. The bipolar mechanism, responsible for the amplification of the deposited charge is discussed based on 2D device simulations. Based on the experimental data we determine qualitatively the influence of transistor geometry on the bipolar gain. Finally the limits of the usual SEU concepts (LET threshold and cross section) are discussed for scaled devices
Keywords :
CMOS integrated circuits; ion beam effects; silicon-on-insulator; 2D simulation; LET threshold; SEU; bipolar gain; charge amplification; charge collection spectroscopy; cross section; high energy ion strike; scaled device; submicron CMOS/SOI technology; transistor; upset; CMOS technology; Charge measurement; Current measurement; Dielectric thin films; Isolation technology; MOSFETs; Single event upset; Spectroscopy; Testing; Thin film transistors;
fLanguage :
English
Journal_Title :
Nuclear Science, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9499
Type :
jour
DOI :
10.1109/23.659027
Filename :
659027
Link To Document :
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