24-GHz modulation bandwidth and passive alignment of flip-chip mounted DFB laser diodes

Author

Lindgren, Stefan ; Ahlfeldt, H. ; Backlin, L. ; Forssen, L. ; Vieider, Christian ; Elderstig, Hakan ; Svensson, Magnus ; Granlund, Lennart ; Andersson, Lars ; Kerzar, Boris ; Broberg, Bjöorn ; Kjebon, Olle ; Schatz, Richard ; Forzelius, Elisabeth ; Nilsso

Author_Institution

Ind. Microelectron. Center, Kista, Sweden

Volume

9

Issue

3

fYear

1997

fDate

3/1/1997 12:00:00 AM

Firstpage

306

Lastpage

308

Abstract

High-frequency lasers have been flip-chip mounted on silicon motherboards. Small-signal modulation bandwidths around 24 GHz were obtained. It was shown that the bandwidth was not limited by extrinsic parasitics associated with the mounting scheme. Lasers were passively aligned to single mode fibers in V-grooves with the self-aligning solder bump technique. By passive alignment 50% of maximum coupling efficiency obtained by active alignment was achieved.

Keywords

distributed feedback lasers; electro-optical modulation; flip-chip devices; integrated optoelectronics; optical interconnections; optical transmitters; quantum well lasers; semiconductor device packaging; 24 GHz; 24-GHz modulation bandwidth; InGaAsP; Si; V-grooves; extrinsic parasitics; flip-chip mounted DFB laser diodes; flip-chip mounting; high-frequency lasers; maximum coupling efficiency; passive alignment; self-aligning solder bump technique; silicon motherboards; single mode fibers; small-signal modulation bandwidths; strained layer MQW InGaAsP lasers; Bandwidth; Diode lasers; Fiber lasers; Laser modes; Masers; Optical fiber communication; Optical fibers; Optical modulation; Silicon; Surface emitting lasers;

fLanguage

English

Journal_Title

Photonics Technology Letters, IEEE

Publisher

ieee

ISSN

1041-1135

Type

jour

DOI

10.1109/68.556055

Filename

556055