DocumentCode :
1309736
Title :
The art of building LSIs
Author :
Hochman, Herschel T.
Author_Institution :
Honeywell Inc.
Volume :
6
Issue :
9
fYear :
1969
Firstpage :
29
Lastpage :
36
Abstract :
Today solid-state technology has improved to such a degree that very large IC chips are being made with yields up to 30 percent. This article highlights some of the main elements that determine whether LSIs can be manufactured in large quantities. The author claims that obtaining reasonable yields is readily achievable once the factors that stand out as deterrents to success are recognized. Previously developed manufacturing techniques are used for LSI production. In the future, however, lasers and the computer will be applied to enable engineers to produce components faster with greater reliability.
Keywords :
Art; Bonding; Circuit testing; Conductivity; Large scale integration; Manufacturing; Resistors; Silicon; Solid state circuit design; Solid state circuits;
fLanguage :
English
Journal_Title :
Spectrum, IEEE
Publisher :
ieee
ISSN :
0018-9235
Type :
jour
DOI :
10.1109/MSPEC.1969.5213671
Filename :
5213671
Link To Document :
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