• DocumentCode
    1310903
  • Title

    Postfabrication Electrical Trimming of Silicon Micromechanical Resonators via Joule Heating

  • Author

    Samarao, Ashwin K. ; Ayazi, Farrokh

  • Author_Institution
    Integrated Device Technol., Inc., San Jose, CA, USA
  • Volume
    20
  • Issue
    5
  • fYear
    2011
  • Firstpage
    1081
  • Lastpage
    1088
  • Abstract
    This paper presents a method to electrically trim the resonance frequency of a silicon bulk acoustic resonator (SiBAR) after its fabrication is completed. The small volume of the microresonator can be Joule heated to a sufficiently high temperature to allow for diffusion of deposited metals from its surface onto its bulk. Such high temperatures also facilitate the formation of silicon-metal bonds which, depending on the metal, are either stronger or weaker compared to the existing silicon-silicon bonds. The former leads to an overall increased stiffness of the resonating element thereby trimming up its resonance frequency, while the latter does the opposite. Both trimming-up and trimming-down by ~400 kHz have been demonstrated at a resonance frequency of 100 MHz (i.e., trimming range of 4000 ppm) using gold and aluminum, respectively. The possibility of increasing the trimming range to ~4 MHz (i.e., 40 000 ppm) by engineering the resonator geometry is also discussed and demonstrated.
  • Keywords
    acoustic resonators; bulk acoustic wave devices; elemental semiconductors; microfabrication; micromechanical resonators; silicon; Joule heating; Si; frequency 100 MHz; microresonator; post fabrication electrical trimming; resonance frequency; resonator geometry; silicon bulk acoustic resonator; silicon micromechanical resonators; silicon-metal bonds; Aluminum; Gold; Heating; Resonant frequency; Silicon; Temperature measurement; Electrical trimming; Joule heating; postfabrication; thermomigration;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2011.2162489
  • Filename
    6006496