Title :
Failure analysis of solder bumped flip chip on low-cost substrates
Author :
Lau, John H. ; Chang, Chris ; Lee, S. W Ricky
Author_Institution :
Express Packaging Syst. Inc., Palo Alto, CA, USA
fDate :
1/1/2000 12:00:00 AM
Abstract :
Failure analyses of 63/37 Sn/Pb solder bumped flip chip assemblies with underfill encapsulant are presented in this study, Emphasis is placed on solder flowed-out, nonuniform underfill and voids, and delaminations. The X-ray, scanning acoustic microscope (SAM), and tomographic acoustic micro imaging (TAMI) techniques are used to analyze the failed samples. Also, cross sections are examined for a better understanding of the failure mechanisms. Furthermore, temperature dependent nonlinear finite element analyses together with fracture mechanics are used to determine the effects of underfill void sizes on the flip chip solder joint reliability
Keywords :
acoustic microscopy; acoustic tomography; delamination; encapsulation; failure analysis; finite element analysis; flip-chip devices; fracture mechanics; integrated circuit reliability; lead alloys; reflow soldering; tin alloys; SnPb; delaminations; failure analyses; fracture mechanics; low-cost substrates; nonuniform underfill; scanning acoustic microscope; solder bumped flip chip; solder joint reliability; temperature dependent nonlinear finite element analyses; tomographic acoustic micro imaging; underfill encapsulant; underfill void sizes; voids; Acoustic imaging; Assembly; Delamination; Failure analysis; Flip chip; Microscopy; Optical imaging; Tin; Tomography; X-ray imaging;
Journal_Title :
Electronics Packaging Manufacturing, IEEE Transactions on
DOI :
10.1109/6104.827522
