DocumentCode :
1313055
Title :
Hybrid integration onto silicon motherboards with planar silica waveguides
Author :
Jones, C.A. ; Cooper, K.
Author_Institution :
British Telecom Res. Labs., Ipswich, UK
Volume :
143
Issue :
5
fYear :
1996
fDate :
10/1/1996 12:00:00 AM
Firstpage :
316
Lastpage :
321
Abstract :
Silicon micromachining can be used in conjunction with silica on silicon waveguide technology to fabricate hybrid optical motherboards. These motherboards comprise optical and electrical interconnects, alignment features for integration of optoelectronic components and electronic circuitry. The development of the principal building blocks of an optical motherboard, and the fabrication of a hybrid integrated optical transceiver, are described
Keywords :
hybrid integrated circuits; integrated optoelectronics; micromachining; optical fabrication; optical interconnections; optical planar waveguides; silicon; silicon compounds; silicon-on-insulator; transceivers; SiO2-Si; alignment features; electrical interconnects; electronic circuitry; hybrid integrated optical transceiver fabrication; hybrid integration; hybrid optical motherboard fabrication; optical interconnects; optoelectronic component integration; planar silica waveguides; principal building blocks; silica on silicon waveguide technology; silicon micromachining; silicon motherboards;
fLanguage :
English
Journal_Title :
Optoelectronics, IEE Proceedings -
Publisher :
iet
ISSN :
1350-2433
Type :
jour
DOI :
10.1049/ip-opt:19960731
Filename :
556357
Link To Document :
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