Title :
Quench behaviors of QMG current limiting elements under the influence of magnetic field
Author :
Kato, H. ; Miura, O. ; Ito, D.
Author_Institution :
Graduate Sch. of Eng., Tokyo Metropolitan Univ., Japan
fDate :
3/1/2000 12:00:00 AM
Abstract :
The superconducting fault current limiter (SFCL) is a very attractive device for power networks, therefore, a lot of research and development has been conducted for several types of SFCLs. We have studied quench properties of QMG (quench melt growth) YBCO bulk elements for a resistive type SFCL. The bulk element has a high critical current density J/sub c/ exceeding 10000 A/cm/sup 2/ at 77 K and could carry 2 kA transport current. In order to protect the element from burn-out during quenching, the element has not only coatings such as Ag and solder but also a magnetic field applied to the element simultaneous with the quench. The magnetic field helps the quenching by decreasing the J/sub c/ for the whole element. Quench behaviors of the QMG bulk elements under pulsed magnetic fields up to 0.43 T generated by a magnet with copper windings were studied in liquid argon whose boiling point is 87.3 K. Successful quench of the entire element was observed.
Keywords :
barium compounds; critical current density (superconductivity); fault current limiters; high-temperature superconductors; magnetic fields; superconducting devices; yttrium compounds; 0.87 T; 2 kA; 77 K; Ag coatings; YBCO bulk elements; YBa/sub 2/Cu/sub 3/O/sub 7/; burn-out protection; copper windings; high critical current density; liquid argon; magnetic field; power networks; pulsed magnetic fields; quench behaviors; quench melt growth current limiting elements; quench properties; resistive type superconducting fault current limiter; solder coatings; transport current; Coatings; Critical current density; Current limiters; Fault current limiters; Magnetic fields; Protection; Pulse generation; Research and development; Superconducting magnets; Yttrium barium copper oxide;
Journal_Title :
Applied Superconductivity, IEEE Transactions on