A package design technique for size reduction of implantable bioelectronic systems

Author

Soma, Mani

Author_Institution

Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA

Volume

37

Issue

5

fYear

1990

fDate

5/1/1990 12:00:00 AM

Firstpage

482

Lastpage

488

Abstract

Several substrate and package design techniques for minimizing the overall size of bioelectronic systems, especially those that will be implanted for in vivo studies, are presented. The emphasis is on a new capacitor attachment and a new double-substrate design that have been successfully applied to the packaging of an implantable auditory prosthesis. The entire procedure for this case is described and compared with standard techniques to illustrate the advantages of this new approach in packaging.

Keywords

biomedical electronics; packaging; prosthetics; capacitor attachment; double-substrate design; implantable auditory prosthesis; implantable bioelectronic systems; medical electronics; package design technique; size reduction; Bonding; Capacitors; Digital-analog conversion; Electrodes; Electronics packaging; Helium; In vivo; Integrated circuit packaging; Prosthetics; Signal processing; Cochlear Implants; Electric Conductivity; Electronics; Electronics, Medical; Equipment Design; Miniaturization; Prostheses and Implants; Signal Processing, Computer-Assisted;

fLanguage

English

Journal_Title

Biomedical Engineering, IEEE Transactions on

Publisher

ieee

ISSN

0018-9294

Type

jour

DOI

10.1109/10.55650

Filename

55650