• DocumentCode
    131415
  • Title

    Clock domain crossing (CDC) for inter-logic-layer communication in 3-D ICs

  • Author

    Gul, W. ; Hasan, Syed Rafay ; Hasan, Osman

  • Author_Institution
    Sch. of Electr. Eng. & Comput. Sci., Nat. Univ. of Sci. & Technol., Islamabad, Pakistan
  • fYear
    2014
  • fDate
    22-25 June 2014
  • Firstpage
    476
  • Lastpage
    479
  • Abstract
    3D technology is becoming more popular due to improved design density and performance. However, single global clock distribution to a complex system, like 3-D IC, is a very challenging task. Due to potentially heterogeneous, dice integration also omens for increasing environmental and process non-idealities. Therefore, inter-logic layer communication in 3-D ICs can leverage from clock domain crossing (CDC) techniques to perform timely and correct data transactions. In this paper, we investigate two classes of CDC techniques, the pseudo quasi-delay insensitive (QDI) based GALS and loosely synchronous CDC technique under 3-D IC context. It is found that although pseudo QDI based GALS design provides an attractive solution because of the relaxed constraint on clock distribution network, but for 8 or higher data-bits/transaction its hardware overhead becomes more than the loosely synchronous design. To the best of authors´ knowledge this is a premier work in investigating design guidelines for CDC techniques in through silicon via (TSV) based 3-D ICs.
  • Keywords
    clock distribution networks; integrated circuit design; three-dimensional integrated circuits; 3D IC context; CDC techniques; QDI; TSV; clock domain crossing; complex system; data transactions; data-bits; dice integration; environmental nonidealities; globally asynchronous and locally synchronous design; hardware overhead; inter-logic-layer communication; process nonidealities; pseudo quasi-delay insensitive based GALS; relaxed constraint; single global clock distribution; through silicon via; Clocks; Delays; Encoding; Integrated circuit modeling; Synchronization; Through-silicon vias; 3-D ICs; Clock Domain Crossing; GALS; TSV;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    New Circuits and Systems Conference (NEWCAS), 2014 IEEE 12th International
  • Conference_Location
    Trois-Rivieres, QC
  • Type

    conf

  • DOI
    10.1109/NEWCAS.2014.6934086
  • Filename
    6934086